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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | MC-22107F1-DE1-B10 |
Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns; |
Datasheet | MC-22107F1-DE1-B10 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00002 Amp |
Sub-Category: | Other Memory ICs |
Surface Mount: | YES |
Maximum Supply Current: | 70 mA |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 48 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | HYBRID |
JESD-30 Code: | R-PBGA-B48 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Mixed Memory Type: | FLASH+SRAM |
Memory IC Type: | MEMORY CIRCUIT |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -20 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA48,6X8,40 |
Maximum Access Time: | 100 ns |
Terminal Pitch: | 1 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 3/3.3 |