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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | R5F363AMNLG#U0 |
Description | Microcontrollers; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | R5F363AMNLG#U0 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 100 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B100 |
Package Shape: | SQUARE |
ROM Words: | 524288 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 1 |
Speed: | 20 rpm |
RAM Bytes: | 31744 |
Bit Size: | 16 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -20 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA100,10X10,20 |
ROM Programmability: | FLASH |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 2/5 |
CPU Family: | M16C |