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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | R8A77850AADBG |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 436; Package Code: HFBGA; Package Shape: SQUARE; |
Datasheet | R8A77850AADBG Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
No. of DMA Channels: | 12 |
Address Bus Width: | 26 |
Technology: | CMOS |
Maximum Clock Frequency: | 67 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HFBGA |
Moisture Sensitivity Level (MSL): | 1 |
No. of External Interrupts: | 9 |
Bit Size: | 32 |
DAC Channels: | NO |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA436,22X22,32 |
PWM Channels: | NO |
Connectivity: | SCI(6), SIO, SPI, SSI(2) |
Terminal Pitch: | .8 mm |
CPU Family: | SH7785 |
Nominal Supply Voltage: | 1.1 V |
Maximum Seated Height: | 2.6 mm |
Maximum Supply Current: | 3000 mA |
ADC Channels: | NO |
No. of Terminals: | 436 |
No. of Timers: | 1 |
No. of Serial I/Os: | 7 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Format: | FLOATING-POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
No. of I/O Lines: | 111 |
JESD-30 Code: | S-PBGA-B436 |
Maximum Operating Temperature: | 85 Cel |
Width: | 19 mm |
Data EEPROM Size: | 0 |
Speed: | 603 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.2 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Peripherals: | DMA(12), TIMER(6), WDT |
Minimum Operating Temperature: | -40 Cel |
Length: | 19 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.1,1.8,3.3 |