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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | TSI577-10GCL |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 399; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | TSI577-10GCL Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 399 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 21 mm |
| JESD-30 Code: | S-PBGA-B399 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HBGA |
| Width: | 21 mm |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
