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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPB406D-2 |
Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm; |
Datasheet | UPB406D-2 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Organization: | 1KX4 |
Sub-Category: | OTP ROMs |
Surface Mount: | NO |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 18 |
No. of Words: | 1024 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | TTL |
JESD-30 Code: | R-XDIP-T18 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 4096 bit |
Memory IC Type: | OTP ROM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 4 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP18,.3 |
Maximum Access Time: | 50 ns |
No. of Words Code: | 1K |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |