Image shown is a representation only.
| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | UPD23C32383F9-XXX-BC3 |
| Description | MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns; |
| Datasheet | UPD23C32383F9-XXX-BC3 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00003 Amp |
| Organization: | 2MX16 |
| Sub-Category: | MASK ROMs |
| Surface Mount: | YES |
| No. of Terminals: | 48 |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | MOS |
| JESD-30 Code: | R-PBGA-B48 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Memory Density: | 33554432 bit |
| Memory IC Type: | MASK ROM |
| Minimum Operating Temperature: | -10 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA48,6X8,32 |
| Maximum Access Time: | 100 ns |
| No. of Words Code: | 2M |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.8,3/3.3 |
