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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD30131F1-200-GA2 |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 224; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | UPD30131F1-200-GA2 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Speed: | 200 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Bit Size: | 32 |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 224 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA224,18X18,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B224 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.5,3.3 |