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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD30550AF2-300-NN1 |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified; |
Datasheet | UPD30550AF2-300-NN1 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 10 |
Maximum Seated Height: | 2.05 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 272 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 64 |
Technology: | MOS |
JESD-30 Code: | S-PBGA-B272 |
Maximum Clock Frequency: | 133 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Width: | 29 mm |
Speed: | 300 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.575 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Bit Size: | 64 |
JESD-609 Code: | e1 |
Qualification: | Not Qualified |
Length: | 29 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |