UPD44325094BF5-E50-FQ1-A by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	UPD44325094BF5-E50-FQ1-A
Description	QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B165;
Datasheet	UPD44325094BF5-E50-FQ1-A Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.35 Amp
Organization:	4MX9
Output Characteristics:	3-STATE
Maximum Seated Height:	1.46 mm
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	410 mA
No. of Terminals:	165
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	LBGA
Width:	15 mm
Input/Output Type:	SEPARATE
Memory Density:	37748736 bit
Minimum Standby Voltage:	1.7 V
Memory IC Type:	QDR SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	9
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA165,11X15,40
Length:	17 mm
Maximum Access Time:	.45 ns
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	1.9 V
Power Supplies (V):	1.5/1.8,1.8

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