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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD454D |
Description | EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC; |
Datasheet | UPD454D Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Organization: | 256X8 |
Sub-Category: | EEPROMs |
Surface Mount: | NO |
Command User Interface: | NO |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 24 |
No. of Words: | 256 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | MOS |
JESD-30 Code: | R-XDIP-T24 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 2048 bit |
Toggle Bit: | NO |
Memory IC Type: | EEPROM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -10 Cel |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP24,.6 |
Maximum Access Time: | 800 ns |
No. of Words Code: | 256 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Data Polling: | NO |
Power Supplies (V): | 5,12 |