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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD4632312F9-B85X-BT3 |
Description | Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 77; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Width: 16; |
Datasheet | UPD4632312F9-B85X-BT3 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .0001 Amp |
Organization: | 2MX16 |
Output Characteristics: | 3-STATE |
Sub-Category: | Other Memory ICs |
Surface Mount: | YES |
Maximum Supply Current: | 35 mA |
No. of Terminals: | 77 |
No. of Words: | 2097152 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B77 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Input/Output Type: | COMMON |
Memory Density: | 33554432 bit |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA77,8X14,32 |
Maximum Access Time: | 85 ns |
No. of Words Code: | 2M |
Nominal Supply Voltage / Vsup (V): | 3 |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 3 |