UPD4664312F9-CE80X-CR2 by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	UPD4664312F9-CE80X-CR2
Description	Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 93; Package Code: FBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
Datasheet	UPD4664312F9-CE80X-CR2 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00001 Amp
Organization:	4MX16
Output Characteristics:	3-STATE
Sub-Category:	Other Memory ICs
Surface Mount:	YES
No. of Terminals:	93
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B93
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Input/Output Type:	COMMON
Memory Density:	67108864 bit
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	BGA93,10X14,32
Maximum Access Time:	80 ns
No. of Words Code:	4M
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.8/2,2.5

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