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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | UPD4664312F9-E10X-CR2 |
| Description | Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 93; Package Code: FBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | UPD4664312F9-E10X-CR2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00001 Amp |
| Organization: | 4MX16 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| No. of Terminals: | 93 |
| No. of Words: | 4194304 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B93 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Input/Output Type: | COMMON |
| Memory Density: | 67108864 bit |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA93,10X14,32 |
| Maximum Access Time: | 100 ns |
| No. of Words Code: | 4M |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8/2 |
