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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | UPD48288209AFF-E24-DW1 |
| Description | DDR1 DRAM; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Input/Output Type: COMMON; |
| Datasheet | UPD48288209AFF-E24-DW1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX9 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| No. of Terminals: | 144 |
| Maximum Clock Frequency (fCLK): | 400 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B144 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| Memory Density: | 301989888 bit |
| Memory IC Type: | DDR1 DRAM |
| Memory Width: | 9 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA144,12X18,40/32 |
| Interleaved Burst Length: | 2,4,8 |
| No. of Words Code: | 32M |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1.8,2.5 |
