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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD66702F1-YXX-HN3 |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 240; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | UPD66702F1-YXX-HN3 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.3 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 450 mA |
ADC Channels: | YES |
No. of Terminals: | 240 |
DMA Channels: | NO |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 28 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B240 |
Maximum Clock Frequency: | 4.04 MHz |
Package Shape: | SQUARE |
ROM Words: | 3072 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Width: | 19 mm |
Speed: | 60 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 2.7 V |
RAM Bytes: | 8192 |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA240,22X22,32 |
Length: | 19 mm |
PWM Channels: | YES |
ROM Programmability: | MROM |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5,3.3 |
CPU Family: | ARM7 |