Renesas Electronics - UPD66702F1-YXX-HN3

UPD66702F1-YXX-HN3 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD66702F1-YXX-HN3
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 240; Package Code: FBGA; Package Shape: SQUARE;
Datasheet UPD66702F1-YXX-HN3 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.5 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 450 mA
ADC Channels: YES
No. of Terminals: 240
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 28
Technology: CMOS
JESD-30 Code: S-PBGA-B240
Maximum Clock Frequency: 4.04 MHz
Package Shape: SQUARE
ROM Words: 3072
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Width: 19 mm
Speed: 60 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 2.7 V
RAM Bytes: 8192
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA240,22X22,32
Length: 19 mm
PWM Channels: YES
ROM Programmability: MROM
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5,3.3
CPU Family: ARM7
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