Renesas Electronics - UPD703100AF1-33-FA3

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UPD703100AF1-33-FA3 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD703100AF1-33-FA3
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 157; Package Code: FBGA; Package Shape: SQUARE;
Datasheet UPD703100AF1-33-FA3 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 33 rpm
Nominal Supply Voltage: 3.3 V
RAM Bytes: 4096
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 32
Maximum Supply Current: 137 mA
Minimum Operating Temperature: -40 Cel
No. of Terminals: 157
Qualification: Not Qualified
Package Equivalence Code: BGA157,16X16,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B157
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
CPU Family: V850
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