Renesas Electronics - UPD75CG19HE

UPD75CG19HE by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD75CG19HE
Description Microcontrollers; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 64; Package Code: QIP; Package Shape: RECTANGULAR;
Datasheet UPD75CG19HE Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Microcontrollers
Surface Mount: NO
Maximum Supply Current: 3.6 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 64
Terminal Position: QUAD
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-XQIP-P64
Package Shape: RECTANGULAR
ROM Words: 4096
Terminal Form: PIN/PEG
Maximum Operating Temperature: 70 Cel
Package Code: QIP
Speed: 6.6 rpm
RAM Bytes: 128
Bit Size: 4
JESD-609 Code: e0
Minimum Operating Temperature: -10 Cel
Qualification: Not Qualified
Package Equivalence Code: QUIP64A,.7/.9
ROM Programmability: EPROM
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
CPU Family: UPD7500
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