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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | UPD75CG33E |
| Description | Microcontrollers; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | UPD75CG33E Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Sub-Category: | Microcontrollers |
| Surface Mount: | NO |
| Maximum Supply Current: | 3 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 42 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDIP-T42 |
| Package Shape: | RECTANGULAR |
| ROM Words: | 4096 |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Speed: | .26 rpm |
| RAM Bytes: | 80 |
| Bit Size: | 4 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -10 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP42,.6 |
| ROM Programmability: | EPROM |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3/5 |
| CPU Family: | UPD7500 |









