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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD780354YF1-XXX-DA3 |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 113; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | UPD780354YF1-XXX-DA3 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 12.6 mA |
No. of Terminals: | 113 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B113 |
Package Shape: | SQUARE |
ROM Words: | 32768 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Speed: | 10 rpm |
RAM Bytes: | 1024 |
Bit Size: | 8 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA113,11X11,32 |
ROM Programmability: | MROM |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2/5 |
CPU Family: | UPD78K0 |