Renesas Technology - HD64F2318VTE25V

HD64F2318VTE25V by Renesas Technology

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Manufacturer Renesas Technology
Manufacturer's Part Number HD64F2318VTE25V
Description MICROCONTROLLER; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
Datasheet HD64F2318VTE25V Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.2 mm
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 100
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH
No. of I/O Lines: 79
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Package Shape: SQUARE
ROM Words: 262144
Terminal Form: GULL WING
Maximum Operating Temperature: 75 Cel
Package Code: TFQFP
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Speed: 25 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
RAM Bytes: 8192
External Data Bus Width: 16
Bit Size: 16
DAC Channels: YES
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: TQFP100,.63SQ
Length: 14 mm
PWM Channels: YES
On Chip Program ROM Width: 8
Additional Features: IT ALSO HAS WIDE RANGE TEMP OF MINUS 40 TO PLUS 85
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 3.3
CPU Family: H8S/2000
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