Image shown is a representation only.
| Manufacturer | ROHM |
|---|---|
| Manufacturer's Part Number | BR25A256FJ-3MGE2 |
| Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED; |
| Datasheet | BR25A256FJ-3MGE2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32KX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.65 mm |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Surface Mount: | YES |
| Maximum Write Cycle Time (tWC): | 5 ms |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 5 MHz |
| No. of Words: | 32768 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, LOW PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | LSOP |
| Width: | 3.9 mm |
| Serial Bus Type: | SPI |
| Memory Density: | 262144 bit |
| Memory IC Type: | EEPROM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | 4.9 mm |
| No. of Words Code: | 32K |
| Additional Features: | SEATED HT-CALCULATED |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
