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| Manufacturer | ROHM |
|---|---|
| Manufacturer's Part Number | BRCF016GWZ-3E2 |
| Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; |
| Datasheet | BRCF016GWZ-3E2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 2KX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .35 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Maximum Write Cycle Time (tWC): | 5 ms |
| No. of Terminals: | 4 |
| Maximum Clock Frequency (fCLK): | 1 MHz |
| No. of Words: | 2048 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B4 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | .84 mm |
| Serial Bus Type: | I2C |
| Memory Density: | 16384 bit |
| Memory IC Type: | EEPROM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | .86 mm |
| No. of Words Code: | 2K |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
