
Image shown is a representation only.
Manufacturer | ROHM |
---|---|
Manufacturer's Part Number | BU9833GUL-WE2 |
Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; |
Datasheet | BU9833GUL-WE2 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .000002 Amp |
Organization: | 256X8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | .55 mm |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | EEPROMs |
Surface Mount: | YES |
Maximum Supply Current: | 2 mA |
Maximum Write Cycle Time (tWC): | 5 ms |
No. of Terminals: | 6 |
I2C Control Byte: | 1010D00R |
Maximum Clock Frequency (fCLK): | .4 MHz |
No. of Words: | 256 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Write Protection: | HARDWARE |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B6 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Package Code: | VFBGA |
Width: | 1.27 mm |
Serial Bus Type: | I2C |
Memory Density: | 2048 bit |
Memory IC Type: | EEPROM |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA6,2X3,20 |
Length: | 1.5 mm |
No. of Words Code: | 256 |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Minimum Data Retention Time: | 40 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 5.5 V |
Power Supplies (V): | 1.8/5 |