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| Manufacturer | Samsung Electro-mechanics |
|---|---|
| Manufacturer's Part Number | K4F6E3S4HM-MGCJ |
| Description | LPDDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 200; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1; |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 17179869184 bit |
| Organization: | 512MX32 |
| Surface Mount: | YES |
| Memory IC Type: | LPDDR4 DRAM |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| No. of Terminals: | 200 |
| No. of Words: | 536870912 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| No. of Words Code: | 512M |
| JESD-30 Code: | R-PBGA-B200 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Temperature Grade: | OTHER |
