K1B5616B2M000000 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K1B5616B2M000000
Description	PSEUDO STATIC RAM; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: RECTANGULAR; Memory Density: 268435456 bit; Memory Width: 16;
Datasheet	K1B5616B2M000000 Datasheet

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Organization:	16MX16
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Words:	16777216 words
Terminal Position:	UPPER
Package Style (Meter):	UNCASED CHIP
Technology:	CMOS
JESD-30 Code:	R-XUUC-N
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	DIE
Memory Density:	268435456 bit
Memory IC Type:	PSEUDO STATIC RAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	70 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	PARALLEL
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V

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