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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K1B6416B6C-BI700 |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns; |
| Datasheet | K1B6416B6C-BI700 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .18 Amp |
| Mixed Memory Type: | FLASH+PSRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 40 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 54 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA54,6X9,30 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| Maximum Access Time: | 70 ns |
| JESD-30 Code: | R-PBGA-B54 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Nominal Supply Voltage / Vsup (V): | 1.85 |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .75 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.85 |
