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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K1S1616B5M-EE85 |
| Description | DRAMs; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Organization: 1MX16; |
| Datasheet | K1S1616B5M-EE85 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00006 Amp |
| Organization: | 1MX16 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 25 mA |
| No. of Terminals: | 48 |
| No. of Words: | 1048576 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B48 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 16777216 bit |
| Minimum Standby Voltage: | 1.7 V |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA48,6X8,30 |
| Maximum Access Time: | 85 ns |
| No. of Words Code: | 1M |
| Terminal Pitch: | .75 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8/2 |
