K3N3V(U)3000D-YC by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K3N3V(U)3000D-YC
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Datasheet	K3N3V(U)3000D-YC Datasheet

NAME	DESCRIPTION
Organization:	512KX8
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	25 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	32
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-XDSO-G32
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Package Code:	TSOP
Memory Density:	4194304 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	TSOP32,.8
Maximum Access Time:	120 ns
No. of Words Code:	512K
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	3/3.3

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