K3P4U1000F-TE12 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K3P4U1000F-TE12
Description	MASK ROM; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 8388608 bit;
Datasheet	K3P4U1000F-TE12 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	512KX16
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	35 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	44
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G44
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSOP
Memory Density:	8388608 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	-20 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	TSOP44,.46,32
Alternate Memory Width:	8
Maximum Access Time:	120 ns
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	3
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	3

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