K3P6C2000B-SC12 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K3P6C2000B-SC12
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 70; Package Code: SSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP70,.63,32;
Datasheet	K3P6C2000B-SC12 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	1MX32
Maximum Seated Height:	3.1 mm
Minimum Supply Voltage (Vsup):	4.5 V
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	150 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	70
No. of Words:	1048576 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G70
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	SSOP
Width:	12.7 mm
Memory Density:	33554432 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	32
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	SOP70,.63,32
Alternate Memory Width:	16
Length:	28.57 mm
Maximum Access Time:	120 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	5
Additional Features:	ALSO CONFIGURABLE AS 1M X 32
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	5.5 V
Power Supplies (V):	5

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