Samsung - K3QF1F10EM-AGCF0

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K3QF1F10EM-AGCF0 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K3QF1F10EM-AGCF0
Description LPDDR3 DRAM; No. of Terminals: 253; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.14 V; JESD-30 Code: R-PBGA-B253;
Datasheet K3QF1F10EM-AGCF0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128MX32
Maximum Seated Height: .9 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.14 V
Surface Mount: YES
No. of Terminals: 253
No. of Words: 134217728 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B253
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: VFBGA
Width: 11 mm
No. of Ports: 2
Memory Density: 4294967296 bit
Self Refresh: YES
Memory IC Type: LPDDR3 DRAM
Memory Width: 32
No. of Functions: 1
Length: 11.5 mm
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Terminal Pitch: .5 mm
Maximum Supply Voltage (Vsup): 1.3 V
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