Samsung - K4C560838F-TCD3

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K4C560838F-TCD3 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K4C560838F-TCD3
Description DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 2.5;
Datasheet K4C560838F-TCD3 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32MX8
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 66
Maximum Clock Frequency (fCLK): 167 MHz
No. of Words: 33554432 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G66
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: TSSOP
Input/Output Type: COMMON
Memory Density: 268435456 bit
Sequential Burst Length: 2,4
Memory IC Type: DDR1 DRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: TSSOP66,.46
Interleaved Burst Length: 2,4
Maximum Access Time: .85 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 2.5
Terminal Pitch: .635 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 2.5
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