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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4D553235F-GC25T |
| Description | GDDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: FBGA; Refresh Cycles: 4096; Package Shape: SQUARE; |
| Datasheet | K4D553235F-GC25T Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 8MX32 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 368 mA |
| No. of Terminals: | 144 |
| Maximum Clock Frequency (fCLK): | 400 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B144 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 65 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 268435456 bit |
| Sequential Burst Length: | 2,4,8 |
| Memory IC Type: | GDDR1 DRAM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 32 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA144,12X12,32 |
| Refresh Cycles: | 4096 |
| Interleaved Burst Length: | 2,4,8 |
| Maximum Access Time: | .45 ns |
| No. of Words Code: | 8M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.8 |
