Samsung - K4F6E3D4HB-MFCJ0

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K4F6E3D4HB-MFCJ0 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K4F6E3D4HB-MFCJ0
Description LPDDR4 DRAM; No. of Terminals: 200; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 512M; Package Body Material: PLASTIC/EPOXY;
Datasheet K4F6E3D4HB-MFCJ0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
No. of Ports: 1
Memory Density: 17179869184 bit
Organization: 512MX32
Surface Mount: YES
Memory IC Type: LPDDR4 DRAM
Memory Width: 32
No. of Functions: 1
No. of Terminals: 200
No. of Words: 536870912 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
No. of Words Code: 512M
JESD-30 Code: R-PBGA-B200
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Package Code: BGA
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