Image shown is a representation only.
| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4F8E304HB-MGCJ0 |
| Description | LPDDR4 DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 200; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; No. of Words Code: 256M; |
| Datasheet | K4F8E304HB-MGCJ0 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| No. of Ports: | 1 |
| Memory Density: | 8589934592 bit |
| Organization: | 256MX32 |
| Self Refresh: | NO |
| Surface Mount: | YES |
| Memory IC Type: | LPDDR4 DRAM |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| No. of Terminals: | 200 |
| No. of Words: | 268435456 words |
| Terminal Position: | BOTTOM |
| Technology: | CMOS |
| No. of Words Code: | 256M |
| JESD-30 Code: | R-PBGA-B200 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Maximum Operating Temperature: | 85 Cel |
| Temperature Grade: | COMMERCIAL EXTENDED |
