K4J10324KG-HC140MX by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K4J10324KG-HC140MX
Description	SYNCHRONOUS GRAPHICS RAM; No. of Terminals: 96; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY; Memory Density: 1073741824 bit;
Datasheet	K4J10324KG-HC140MX Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
No. of Ports:	1
Memory Density:	1073741824 bit
Organization:	32MX32
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Memory IC Type:	SYNCHRONOUS GRAPHICS RAM
Memory Width:	32
No. of Functions:	1
No. of Terminals:	96
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
No. of Words Code:	32M
JESD-30 Code:	X-PBGA-B96
Package Shape:	UNSPECIFIED
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Nominal Supply Voltage / Vsup (V):	1.8
Package Code:	BGA
Maximum Supply Voltage (Vsup):	1.9 V

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