Samsung - K4J55323QG-AC140

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K4J55323QG-AC140 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K4J55323QG-AC140
Description GDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 136; Package Code: TFBGA; Package Shape: RECTANGULAR; Access Mode: FOUR BANK PAGE BURST;
Datasheet K4J55323QG-AC140 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8MX32
Maximum Seated Height: 1.2 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 136
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B136
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 11 mm
No. of Ports: 1
Memory Density: 268435456 bit
Self Refresh: YES
Memory IC Type: GDDR3 DRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 32
No. of Functions: 1
Qualification: Not Qualified
Length: 14 mm
Maximum Access Time: .26 ns
No. of Words Code: 8M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.9 V
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