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Manufacturer | Samsung |
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Manufacturer's Part Number | K4R761869A-GCN10 |
Description | RAMBUS DRAM; No. of Terminals: 92; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; No. of Functions: 1; |
Datasheet | K4R761869A-GCN10 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 32MX18 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1 mm |
Access Mode: | BLOCK ORIENTED PROTOCOL |
Minimum Supply Voltage (Vsup): | 2.37 V |
Surface Mount: | YES |
No. of Terminals: | 92 |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B92 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | VFBGA |
Width: | 13.4 mm |
No. of Ports: | 1 |
Memory Density: | 603979776 bit |
Self Refresh: | YES |
Memory IC Type: | RAMBUS DRAM |
Memory Width: | 18 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 15.1 mm |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Additional Features: | SELF CONTAINED REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Maximum Supply Voltage (Vsup): | 2.63 V |