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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4R881869E-GCN1 |
| Description | RAMBUS DRAM; No. of Terminals: 92; Package Code: FBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, FINE PITCH; Peak Reflow Temperature (C): 260; |
| Datasheet | K4R881869E-GCN1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16MX18 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 830 mA |
| No. of Terminals: | 92 |
| Maximum Clock Frequency (fCLK): | 1200 MHz |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B92 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| Memory Density: | 301989888 bit |
| Memory IC Type: | RAMBUS DRAM |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA92,10X18,32 |
| Maximum Access Time: | 32 ns |
| No. of Words Code: | 16M |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1.8/2.5,2.5 |
