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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4S563233F-FF1H |
| Description | SYNCHRONOUS DRAM; Temperature Grade: OTHER; No. of Terminals: 90; Package Code: FBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR; |
| Datasheet | K4S563233F-FF1H Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0005 Amp |
| Organization: | 8MX32 |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 170 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 90 |
| Maximum Clock Frequency (fCLK): | 111 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B90 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Input/Output Type: | COMMON |
| Memory Density: | 268435456 bit |
| Sequential Burst Length: | 1,2,4,8,FP |
| Memory IC Type: | SYNCHRONOUS DRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA90,9X15,32 |
| Refresh Cycles: | 4096 |
| Interleaved Burst Length: | 1,2,4,8 |
| Maximum Access Time: | 7 ns |
| No. of Words Code: | 8M |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 3/3.3 |
