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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4X1G163PC-FGC3 |
| Description | DDR1 DRAM; No. of Terminals: 60; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | K4X1G163PC-FGC3 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| No. of Ports: | 1 |
| Memory Density: | 17179869184 bit |
| Organization: | 1GX16 |
| Access Mode: | FOUR BANK PAGE BURST |
| Surface Mount: | YES |
| Memory IC Type: | DDR1 DRAM |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| No. of Terminals: | 60 |
| No. of Words: | 1073741824 words |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| No. of Words Code: | 1G |
| JESD-30 Code: | R-PBGA-B60 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
