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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K5A3340YBB-T855 |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 69; Package Code: TFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified; |
| Datasheet | K5A3340YBB-T855 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00001 Amp |
| Organization: | 2MX16 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 50 mA |
| No. of Terminals: | 69 |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B69 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 8 mm |
| Memory Density: | 33554432 bit |
| Mixed Memory Type: | FLASH+SRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA69,10X10,32 |
| Length: | 11 mm |
| Maximum Access Time: | 80 ns |
| No. of Words Code: | 2M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Additional Features: | FLASH IS ORGANISED AS 4M X 8 AND ALSO CONTAINS 512K X 8/256K X 16 SRAM |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.3 V |
| Power Supplies (V): | 3 |
