Samsung - K5C6481NTM-T355

K5C6481NTM-T355 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K5C6481NTM-T355
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 81; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet K5C6481NTM-T355 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 81
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B81
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 10.4 mm
Memory Density: 67108864 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 10.8 mm
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 3
Additional Features: ALSO CONTAINS 512K X 16 BIT FULL CMOS SRAM
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.3 V
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