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Manufacturer | Samsung |
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Manufacturer's Part Number | K5C6481NTM-T355 |
Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 81; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; |
Datasheet | K5C6481NTM-T355 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 4MX16 |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 81 |
No. of Words: | 4194304 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B81 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 10.4 mm |
Memory Density: | 67108864 bit |
Memory IC Type: | MEMORY CIRCUIT |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 10.8 mm |
No. of Words Code: | 4M |
Nominal Supply Voltage / Vsup (V): | 3 |
Additional Features: | ALSO CONTAINS 512K X 16 BIT FULL CMOS SRAM |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.3 V |