Samsung - K6F4008S2D-FF70T

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K6F4008S2D-FF70T by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K6F4008S2D-FF70T
Description STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: FBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet K6F4008S2D-FF70T Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000003 Amp
Organization: 512KX8
Output Characteristics: 3-STATE
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 20 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 36
No. of Words: 524288 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B36
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 4194304 bit
Minimum Standby Voltage: 1.5 V
Memory IC Type: STANDARD SRAM
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: BGA36,6X8,30
Maximum Access Time: 70 ns
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 2.5
Parallel or Serial: PARALLEL
Terminal Pitch: .75 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5
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