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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K6R3024V1D-HC09 |
| Description | SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL; |
| Datasheet | K6R3024V1D-HC09 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .015 Amp |
| Organization: | 128KX24 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 170 mA |
| No. of Terminals: | 119 |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B119 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 14 mm |
| Input/Output Type: | COMMON |
| Memory Density: | 3145728 bit |
| Minimum Standby Voltage: | 3.14 V |
| Memory IC Type: | SRAM MODULE |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 24 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA119,7X17,50 |
| Length: | 22 mm |
| Maximum Access Time: | 9 ns |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Peak Reflow Temperature (C): | 240 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |
