Samsung - K6R3024V1D-HC100

K6R3024V1D-HC100 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K6R3024V1D-HC100
Description SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Width: 14 mm;
Datasheet K6R3024V1D-HC100 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128KX24
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
No. of Terminals: 119
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Memory Density: 3145728 bit
Memory IC Type: SRAM MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 24
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 10 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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