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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K7D161874B-HC30 |
| Description | STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 18; |
| Datasheet | K7D161874B-HC30 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .15 Amp |
| Organization: | 1MX18 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 410 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 153 |
| Maximum Clock Frequency (fCLK): | 300 MHz |
| No. of Words: | 1048576 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| Memory Density: | 18874368 bit |
| Minimum Standby Voltage: | 1.7 V |
| Memory IC Type: | STANDARD SRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA153,9X17,50 |
| Maximum Access Time: | 1.9 ns |
| No. of Words Code: | 1M |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.5,2.5 |
