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Manufacturer | Samsung |
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Manufacturer's Part Number | K7D163674B-HC33 |
Description | STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
Datasheet | K7D163674B-HC33 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 512KX36 |
Output Characteristics: | 3-STATE |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 490 mA |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 153 |
Maximum Clock Frequency (fCLK): | 333 MHz |
No. of Words: | 524288 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B153 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Input/Output Type: | COMMON |
Memory Density: | 18874368 bit |
Minimum Standby Voltage: | 1.7 V |
Memory IC Type: | STANDARD SRAM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 36 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA153,9X17,50 |
Maximum Access Time: | 1.7 ns |
No. of Words Code: | 512K |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1.5,2.5 |