K7D401871M-HC22T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K7D401871M-HC22T
Description	STANDARD SRAM; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153; Parallel or Serial: PARALLEL;
Datasheet	K7D401871M-HC22T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.05 Amp
Organization:	256KX18
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	600 mA
No. of Terminals:	153
Maximum Clock Frequency (fCLK):	227 MHz
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	BGA
Input/Output Type:	COMMON
Memory Density:	4718592 bit
Minimum Standby Voltage:	2.4 V
Memory IC Type:	STANDARD SRAM
Memory Width:	18
Qualification:	Not Qualified
Package Equivalence Code:	BGA153,9X17,50
No. of Words Code:	256K
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Power Supplies (V):	1.5,2.5

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