K7D403671M-HC25T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K7D403671M-HC25T
Description	STANDARD SRAM; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Clock Frequency (fCLK): 250 MHz;
Datasheet	K7D403671M-HC25T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.05 Amp
Organization:	128KX36
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	700 mA
No. of Terminals:	153
Maximum Clock Frequency (fCLK):	250 MHz
No. of Words:	131072 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	BGA
Input/Output Type:	COMMON
Memory Density:	4194304 bit
Minimum Standby Voltage:	2.4 V
Memory IC Type:	STANDARD SRAM
Memory Width:	36
Qualification:	Not Qualified
Package Equivalence Code:	BGA153,9X17,50
Maximum Access Time:	2.2 ns
No. of Words Code:	128K
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Power Supplies (V):	1.5,2.5

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